SMT X-ray inspection NDT Non Destructive Testing

Kangni Mechanical & Electrical VENDOR How to quickly detect the problem product and eliminate the defective product? An efficient and practical x-ray non-destructive inspection machine ( NDT ) is a good tool in the production process of an enterprise. Nanjing Kangni Mechanical & Electrical Co., Ltd. (Kangni)  is an innovation-oriented enterprise specialized in research and application of mechanical and electrical technologies. The “Kangni” brand has been registered in countries such as China, the UK, France, Germany, Austria, Italy, the US and Russia, and has been identified as a China Famous Brand. Kangni  is an established door system solution supplier for railway transport, whose clients include internationally renowned car builders such as Bombardier, Alstom and Siemens. Kangni has cooperated with major car builders such as Bombardier. In addition, Kangni also provides related products such as interior fittings, power connectors, platform screen doors, new energy p

PCB Via Через отверстие: покрытие через отверстие (ПТГ) Слепое отверстие: Blind Via Hole (BVH) Похороненное отверстие: погребенная висячая дыра (BVH) www.seamarkxray.com PCB Via 通孔：Plating Through Hole ( PTH ) 盲孔：Blind Via Hole（BVH） 埋孔：Buried Via Hole (BVH) www.seamarkxray.com Vía PCB Agujero pasante: placa a través del agujero (PTH) Agujero ciego: Agujero ciego Via (BVH) Agujero enterrado: Agujero enterrado (BVH) Www.seamarkxray.com PCB Üzerinden Delikten: Delikten Kaplama (PTH) Kör delik: Kör Via Delik (BVH) Gömülü delik: Delikten Gömülü (BVH) www.seamarkxray.com PCBビア スルーホール：めっきスルーホール（PTH） ブラインドホール：ブラインドビアホール（BVH） 埋め込まれた穴：埋め込まれたビアホール（BVH） Www.seamarkxray.com PCB via Trou traversant: placage à travers le trou (PTH) Trou borgne: Aveugle via trou (BVH) Trou enterré: Buried Via Hole (BVH) Www.seamarkxray.com PCB Via Durchgangsloch: Durchkontaktierung (PTH) Sackloch: Sackloch (BVH) Begrabenes Loch: Begrabenes Loch (BVH) Www.seamarkxray.com

Increase ICT test coverage -Bead probe Technology www.seamarkxray.com Original：  PCB assembly increase ICT test coverage Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: “Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the boa

There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down，Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requiring BGA manufa

Formation and prevention of SMT BGA voids SMT BGA voids Formation and prevention News:  The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as  B&P ,  Anda ,  Huancheng , Deshen  Huawei ,  OPPO ,  VIVO ,  Xiaomi ,  ZTE ,  Foxconn ,  Flextronics ,  Lenovo  and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? Orinial:  Formation and prevention of SMT BGA voids BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are many reasons for the formation of BGA voids, such as the crystal structure of the sol