SMT BGA voids Formation and prevention
Formation and prevention of SMT BGA voids SMT BGA voids Formation and prevention News: The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as B&P , Anda , Huancheng , Deshen Huawei , OPPO , VIVO , Xiaomi , ZTE , Foxconn , Flextronics , Lenovo and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? Orinial: Formation and prevention of SMT BGA voids BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are m...