SMT X-ray inspection NDT Non Destructive Testing

Method for detecting electronic components   quickly www.seamarkxray.com   Contact ： Joy    Tel/ WhatsApp/wechat ： +86 18779975930 X-ray is a kind of light with super penetrating power, which can directly penetrate the appearance of the product and directly reach the internal structure of the product. It can play a very important role in the identification of the internal structure of the product. At present, high imitation products are endless, many high Imitation products have similar appearance, but the internal structure design is different, especially the precision products, it is impossible to disassemble at will, so only the advanced technical means can be used to distinguish the product details. Now , the non-destructive testing ( NDT ) method has X-ray inspection machine  and ultrasonic  d etection, magnetic particle testing, NDT x ray detection are as follows: For example, the internal structure of several electronic compone...

X Ray BGA machine use - detecting bga PCB www.seamarkxray.com BGA- B all array package, which is a highly integrated package, uses array solder balls on the bottom of the package substrate to interconnect the I/O terminals of the circuit with the printed circuit board PCB. The quality of the BGA soldering has a large impact on the packaged device. X Ray BGA machine use ： Since the packaged product cannot be visually inspected, X Ray inspection BGA machine, ultrasonic can detect the quality. The most commonly used tool is X-RAY BGA machine, which not only has the function of visual inspection, but also saves the image for analysis ，  area measurements can be made on the contours of product defects. BGA solder joint inspection application: IC, PCBA, LED, lithium battery, IGBT, etc. Object detection: For chip size measurement, chip position, cavity, lead frame, wire, open circuit of connection line, short circuit, abnormal connection, ceramic capacitor structure, tr...