SMT X-ray inspection NDT Non Destructive Testing

x ray inspect  PCB and SMT patch module JIJONQ  Tech nology Co., Ltd offer SMT & DIP manufacturing Service since 1997, Scope of Business:   PCB / FPC SMT 、 DIP 、 Testing 、 Assembly 、 OEM Autotronics processing 、 Purchasing of material. Family of  Industrial X-ray inspection machine  &  BGA rework station Last Article:  Method for detecting electronic components quickly Next Article:  Formation and prevention of SMT BGA voids Hot:   The Reason for BGA insufficient solder & short Maybe you still are interested in :  Solder paste printing defects and solutions in SMT chip processing process Advantages of X-ray SMD counter The difference between the detection equipment AOI & X-RAY    

TSI Mexico  use Seamark x ray www.seamarkxray.com  email: sales25@zhuomao.com.cn  Tel/wechat/whsatspp +861879975930 TSI Mexico-X ray detects Dell computer motherboard defects. MISIÓN Proporcionar servicios de almacenamiento, embalaje, administración de inventarios, distribución, logística, remozamiento, reparación y mantenimiento de equipos electrónicos en alto volumen, de alta tecnología a nivel componente; ofreciendo oportunidad, calidad, y precio. VISIÓN Ser líder a nivel nacional e internacional ofreciendo soluciones integrales e innovadoras que nos permitan satisfacer las necesidades de los clientes y socios estratégicos cumpliendo y excediendo consistentemente sus expectativas. MISSION Provide storage services, packaging, inventory management, distribution, logistics, refurbishment, repair and maintenance of electronic equipment in high volume, high-tech component; offering opportunity, quality, and price. VISION To be a national and international lea...

Skyworth Group pay attention to products quality inspection Orinial:  Skyworth Group pay attention to products quality inspection Founded in 1988,  Skyworth Group Co., Ltd . is mainly engaged in multimedia (smart TV, content operation business), smart appliances (refrigerators, washing machines, air conditioners, kitchen appliances, etc.), intelligent system technology, modern services. Industry and other four major businesses, the group has Skyworth Group (H00751) and Skyworth Digital (000810) two listed companies, several high-tech enterprises, with state-level enterprise technology center, national industrial design center, is “Made in China 2025 The first batch of demonstration units have been among the top 100 Chinese electronics companies for many years. Skyworth Group Co., Ltd Pay Ateention to product quality and brand image all the time. Under the continuous wave of new technology, Skyworth has introduced automatic production lines and quality testing equipmen...

Why LED lamps are getting darker www.seamarkxray.com The LED light source module is generally composed of a substrate, a chip, a packaging material, a lens, etc. In daily use, the long-time operation of the LED easily causes the LED to become darker and darker, and even the light fails. For this problem, D.L. Barton has done research experiments. There are some reasons for the failure of the LED light source module. Generally, the following are the main points: LED lamps are getting darker reasons: 1.The packaging material is degraded; Under long-term work, the LED will cause the temperature of the LED to rise, resulting in a large decrease in the optical transparency of many polymers in the LED exterior packaging material (such as epoxy resin), resulting in a decrease in the light-emitting efficiency of the LED; The study found that when the LED temperature reaches 95 degrees and the current is greater than 40 mA, the LED package material will be carbonized; 2.Dur...

Solder paste printing defects and solutions in SMT chip processing process www.seamarkxray.com    sales25@zhuomao.com.cn +8618779975930 In the SMT chip processing process, solder paste printing is very complicated, and it has very important significance for product quality. This article mainly discusses the common defects of solder paste printing. 1. Incomplete printing: The solder paste has insufficient viscosity and cannot be effectively attached to the PCB or the blade is worn; Solutions: ①Replace the solder paste. When selecting the solder paste, the size of the solid metal particulates should be considered, and the particle size should be smaller than the opening size of the steel mesh; ②Regularly check and replace the scraper; 2. Solder skip, Non-wetting/false soldering: insufficient solder paste or unqualified PCB, easy to appear Solder skip, Non-wetting/false soldering; Solutions: ①Choosing a well-known manufacturer of PCB board brands can reduce t...

Kangni Mechanical & Electrical VENDOR How to quickly detect the problem product and eliminate the defective product? An efficient and practical x-ray non-destructive inspection machine ( NDT ) is a good tool in the production process of an enterprise. Nanjing Kangni Mechanical & Electrical Co., Ltd. (Kangni)  is an innovation-oriented enterprise specialized in research and application of mechanical and electrical technologies. The “Kangni” brand has been registered in countries such as China, the UK, France, Germany, Austria, Italy, the US and Russia, and has been identified as a China Famous Brand. Kangni  is an established door system solution supplier for railway transport, whose clients include internationally renowned car builders such as Bombardier, Alstom and Siemens. Kangni has cooperated with major car builders such as Bombardier. In addition, Kangni also provides related products such as interior fittings, power connectors, platform sc...

PCB Via Через отверстие: покрытие через отверстие (ПТГ) Слепое отверстие: Blind Via Hole (BVH) Похороненное отверстие: погребенная висячая дыра (BVH) www.seamarkxray.com PCB Via 通孔：Plating Through Hole ( PTH ) 盲孔：Blind Via Hole（BVH） 埋孔：Buried Via Hole (BVH) www.seamarkxray.com Vía PCB Agujero pasante: placa a través del agujero (PTH) Agujero ciego: Agujero ciego Via (BVH) Agujero enterrado: Agujero enterrado (BVH) Www.seamarkxray.com PCB Üzerinden Delikten: Delikten Kaplama (PTH) Kör delik: Kör Via Delik (BVH) Gömülü delik: Delikten Gömülü (BVH) www.seamarkxray.com PCBビア スルーホール：めっきスルーホール（PTH） ブラインドホール：ブラインドビアホール（BVH） 埋め込まれた穴：埋め込まれたビアホール（BVH） Www.seamarkxray.com PCB via Trou traversant: placage à travers le trou (PTH) Trou borgne: Aveugle via trou (BVH) Trou enterré: Buried Via Hole (BVH) Www.seamarkxray.com PCB Via Durchgangsloch: Durchkontaktierung (PTH) Sackloch: Sackloch (BVH) Begrabenes Loch: Begrabenes Loch (BVH) Www.seamarkxray.com

Increase ICT test coverage -Bead probe Technology www.seamarkxray.com Original：  PCB assembly increase ICT test coverage Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: “Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the...

Original: SMT BGA solder ball inspection method - Know about cost Usually, when we check the soldering status of BGA solder balls, we can usually check them with  X-ray inspection machine  If we want to check if the solder balls lack solder or cracks/weld bridge/short defects. BGA solder ball inspection Basically ,There are three ways to check the solderability of BGA, using X-rays, Red Dye Penetration Test and slicing. Before you want to analyze the welding status of the BGA, it is recommended that you use  X-ray machine  to see if you can see any problems. The other two methods continue to be used only when X-Ray is unable to determine the problem. There is also a way to use optical instruments to inspect BGA solder balls, such as microscopes or fiber optic miniature cameras, but since the BGA spacing is getting smaller, it usually only checks the two rows of BGAs. Tin ball, another is a bit difficult, so we won’t introduce it here. In fact, there is als...