SMT X-ray inspection NDT Non Destructive Testing

Skyworth Group pay attention to products quality inspection Orinial:  Skyworth Group pay attention to products quality inspection Founded in 1988,  Skyworth Group Co., Ltd . is mainly engaged in multimedia (smart TV, content operation business), smart appliances (refrigerators, washing machines, air conditioners, kitchen appliances, etc.), intelligent system technology, modern services. Industry and other four major businesses, the group has Skyworth Group (H00751) and Skyworth Digital (000810) two listed companies, several high-tech enterprises, with state-level enterprise technology center, national industrial design center, is “Made in China 2025 The first batch of demonstration units have been among the top 100 Chinese electronics companies for many years. Skyworth Group Co., Ltd Pay Ateention to product quality and brand image all the time. Under the continuous wave of new technology, Skyworth has introduced automatic production lines and quality testing equipmen...

Solder paste printing defects and solutions in SMT chip processing process www.seamarkxray.com    sales25@zhuomao.com.cn +8618779975930 In the SMT chip processing process, solder paste printing is very complicated, and it has very important significance for product quality. This article mainly discusses the common defects of solder paste printing. 1. Incomplete printing: The solder paste has insufficient viscosity and cannot be effectively attached to the PCB or the blade is worn; Solutions: ①Replace the solder paste. When selecting the solder paste, the size of the solid metal particulates should be considered, and the particle size should be smaller than the opening size of the steel mesh; ②Regularly check and replace the scraper; 2. Solder skip, Non-wetting/false soldering: insufficient solder paste or unqualified PCB, easy to appear Solder skip, Non-wetting/false soldering; Solutions: ①Choosing a well-known manufacturer of PCB board brands can reduce t...

PCB Via Через отверстие: покрытие через отверстие (ПТГ) Слепое отверстие: Blind Via Hole (BVH) Похороненное отверстие: погребенная висячая дыра (BVH) www.seamarkxray.com PCB Via 通孔：Plating Through Hole ( PTH ) 盲孔：Blind Via Hole（BVH） 埋孔：Buried Via Hole (BVH) www.seamarkxray.com Vía PCB Agujero pasante: placa a través del agujero (PTH) Agujero ciego: Agujero ciego Via (BVH) Agujero enterrado: Agujero enterrado (BVH) Www.seamarkxray.com PCB Üzerinden Delikten: Delikten Kaplama (PTH) Kör delik: Kör Via Delik (BVH) Gömülü delik: Delikten Gömülü (BVH) www.seamarkxray.com PCBビア スルーホール：めっきスルーホール（PTH） ブラインドホール：ブラインドビアホール（BVH） 埋め込まれた穴：埋め込まれたビアホール（BVH） Www.seamarkxray.com PCB via Trou traversant: placage à travers le trou (PTH) Trou borgne: Aveugle via trou (BVH) Trou enterré: Buried Via Hole (BVH) Www.seamarkxray.com PCB Via Durchgangsloch: Durchkontaktierung (PTH) Sackloch: Sackloch (BVH) Begrabenes Loch: Begrabenes Loch (BVH) Www.seamarkxray.com

Increase ICT test coverage -Bead probe Technology www.seamarkxray.com Original：  PCB assembly increase ICT test coverage Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: “Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the...

There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down，Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requir...

Formation and prevention of SMT BGA voids SMT BGA voids Formation and prevention News:  The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as  B&P ,  Anda ,  Huancheng , Deshen  Huawei ,  OPPO ,  VIVO ,  Xiaomi ,  ZTE ,  Foxconn ,  Flextronics ,  Lenovo  and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? Orinial:  Formation and prevention of SMT BGA voids BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are m...

Original: SMT BGA solder ball inspection method - Know about cost Usually, when we check the soldering status of BGA solder balls, we can usually check them with  X-ray inspection machine  If we want to check if the solder balls lack solder or cracks/weld bridge/short defects. BGA solder ball inspection Basically ,There are three ways to check the solderability of BGA, using X-rays, Red Dye Penetration Test and slicing. Before you want to analyze the welding status of the BGA, it is recommended that you use  X-ray machine  to see if you can see any problems. The other two methods continue to be used only when X-Ray is unable to determine the problem. There is also a way to use optical instruments to inspect BGA solder balls, such as microscopes or fiber optic miniature cameras, but since the BGA spacing is getting smaller, it usually only checks the two rows of BGAs. Tin ball, another is a bit difficult, so we won’t introduce it here. In fact, there is als...