SMT X-ray inspection NDT Non Destructive Testing

Method for detecting electronic components   quickly www.seamarkxray.com   Contact ： Joy    Tel/ WhatsApp/wechat ： +86 18779975930 X-ray is a kind of light with super penetrating power, which can directly penetrate the appearance of the product and directly reach the internal structure of the product. It can play a very important role in the identification of the internal structure of the product. At present, high imitation products are endless, many high Imitation products have similar appearance, but the internal structure design is different, especially the precision products, it is impossible to disassemble at will, so only the advanced technical means can be used to distinguish the product details. Now , the non-destructive testing ( NDT ) method has X-ray inspection machine  and ultrasonic  d etection, magnetic particle testing, NDT x ray detection are as follows: For example, the internal structure of several electronic compone...

There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down，Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requir...

Original: SMT BGA solder ball inspection method - Know about cost Usually, when we check the soldering status of BGA solder balls, we can usually check them with  X-ray inspection machine  If we want to check if the solder balls lack solder or cracks/weld bridge/short defects. BGA solder ball inspection Basically ,There are three ways to check the solderability of BGA, using X-rays, Red Dye Penetration Test and slicing. Before you want to analyze the welding status of the BGA, it is recommended that you use  X-ray machine  to see if you can see any problems. The other two methods continue to be used only when X-Ray is unable to determine the problem. There is also a way to use optical instruments to inspect BGA solder balls, such as microscopes or fiber optic miniature cameras, but since the BGA spacing is getting smaller, it usually only checks the two rows of BGAs. Tin ball, another is a bit difficult, so we won’t introduce it here. In fact, there is als...