Solder paste printing defects and solutions in SMT chip processing process
Solder paste printing defects and solutions in SMT chip processing process www.seamarkxray.com sales25@zhuomao.com.cn +8618779975930 In the SMT chip processing process, solder paste printing is very complicated, and it has very important significance for product quality. This article mainly discusses the common defects of solder paste printing. 1. Incomplete printing: The solder paste has insufficient viscosity and cannot be effectively attached to the PCB or the blade is worn; Solutions: ①Replace the solder paste. When selecting the solder paste, the size of the solid metal particulates should be considered, and the particle size should be smaller than the opening size of the steel mesh; ②Regularly check and replace the scraper; 2. Solder skip, Non-wetting/false soldering: insufficient solder paste or unqualified PCB, easy to appear Solder skip, Non-wetting/false soldering; Solutions: ①Choosing a well-known manufacturer of PCB board brands can reduce t...