SMT X-ray inspection NDT Non Destructive Testing

Increase ICT test coverage -Bead probe Technology www.seamarkxray.com Original：  PCB assembly increase ICT test coverage Bead probe technology is an exclusive patent application by Agilent (Keysight Technologies). Using existing wiring to increase ICT (In-Circuit-Test) test point coverage without additional board space, to increase printing. Test points on the board to achieve assembly ICT testing can be used for ICT testing purposes. he density of the parts on the board is getting denser and denser, but the space is getting smaller and smaller, especially the board of the mobile phone. The first thing to be sacrificed is the test point that does not have any function. Many bosses think: “Quality is manufactured, As long as the quality of the board assembly is completed, there is no need for subsequent electrical testing. Which engineer can guarantee that the product does not have a bug? The assembly plant also cannot guarantee that they have zero defects in assembling the...

Formation and prevention of SMT BGA voids SMT BGA voids Formation and prevention News:  The 2nd China Manufacturing Technology-Automation Exhibition (CMM) & the 1st China Electronics Manufacturing Resource Exhibition (CEM) was held at the Dongguan International Convention and Exhibition, such as  B&P ,  Anda ,  Huancheng , Deshen  Huawei ,  OPPO ,  VIVO ,  Xiaomi ,  ZTE ,  Foxconn ,  Flextronics ,  Lenovo  and so on, More than 500 electronic manufacturing companies participated in the exhibition. In the annual feast of the field, the realization of mobile phone production automation can reduce 60% of employees? Orinial:  Formation and prevention of SMT BGA voids BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint. Therefore, from the perspective of reliability, the cavity should be reduced. So how can you reduce BGA voids? There are m...

Original: SMT BGA solder ball inspection method - Know about cost Usually, when we check the soldering status of BGA solder balls, we can usually check them with  X-ray inspection machine  If we want to check if the solder balls lack solder or cracks/weld bridge/short defects. BGA solder ball inspection Basically ,There are three ways to check the solderability of BGA, using X-rays, Red Dye Penetration Test and slicing. Before you want to analyze the welding status of the BGA, it is recommended that you use  X-ray machine  to see if you can see any problems. The other two methods continue to be used only when X-Ray is unable to determine the problem. There is also a way to use optical instruments to inspect BGA solder balls, such as microscopes or fiber optic miniature cameras, but since the BGA spacing is getting smaller, it usually only checks the two rows of BGAs. Tin ball, another is a bit difficult, so we won’t introduce it here. In fact, there is als...

AOI & X-ray Inspection Equipment Advantages AOI (Auto Optical Inspection), It has been widely used in the circuit board assembly line of the electronics industry, and has replaced the previous manual visual inspection operations. AOI uses imaging technology, to determine whether the object under test conforms to the standard based on whether there is a large difference, between the object to be measured and the standard image. Now and In the past Of AOI Before, AOI was used to detect whether the surface printing of the IC (integrated circuit) package was defective. As the technology evolved, Now it was used to detect the PCB assembly on the quality status of SMT assembly line, or check whether the solder paste meets the standards after printing. The biggest advantage of AOI is that it can replace the manual visual inspection before and after  SMT reflow soldering , and it can judge the shortcomings of SMT assembly assembly more accurately than the huma...

According to the latest statistics in 2018, 40% of SMT industry companies already have x ray inspection equipment in China. With the rapid development of electronic technology, the rise of various types of intelligent terminal equipment has become more and more demanding on the quality of circuit assembly,  X Ray machine  ensure long term life of the product. SMT FAI/ First Article Inspection  X-ray System -Purpose of SMT FAI/ First Article Inspection SMT FAI/ First Article Inspection is mainly to find out the factors affecting the quality of the product in the production process as early as possible, and prevent the product from being out of tolerance, repair and scrap. It is a means to pre-control the production process of the product, and it is an important part of the quality control of the product. The method is an effective and indispensable method for enterprises to ensure product quality and improve economic efficiency. Through the SMT FAI...

IC semiconductor X-Ray inspection system X7600 X-Ray inspection system is high-precision detection equipment. It inspects and analyzes the inner structure of the object without damage via the penetration power from X-Ray. It has been widely applied to BGA detection , LED, SMT, semiconductor, battery, automotive electronics, ceramic products, casting, plastic, connectors, 2.5D image analysis, pharmaceutical products and other industries. –Inspection of internal cracks and Defects analysis of internal conditions (Analysis of internal displacements) SMT/Semicon/Solar/Conn/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 100KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digital flat panel detector 6 axis linkage system. 60 degrees observation Platform 360° rotation Color lmage Navigation & Mapping Navigation Mapping Mosaic Function.(optional ) Scalable 3D module(industrial ...