SMT X-ray inspection NDT Non Destructive Testing

Method for detecting electronic components   quickly www.seamarkxray.com   Contact ： Joy    Tel/ WhatsApp/wechat ： +86 18779975930 X-ray is a kind of light with super penetrating power, which can directly penetrate the appearance of the product and directly reach the internal structure of the product. It can play a very important role in the identification of the internal structure of the product. At present, high imitation products are endless, many high Imitation products have similar appearance, but the internal structure design is different, especially the precision products, it is impossible to disassemble at will, so only the advanced technical means can be used to distinguish the product details. Now , the non-destructive testing ( NDT ) method has X-ray inspection machine  and ultrasonic  d etection, magnetic particle testing, NDT x ray detection are as follows: For example, the internal structure of several electronic compone...

There are cases of insufficient solder and solder short in BGA soldering, but it is also possible. Because the PCB BGA board has too much gap due to heat shrinkage (CTE), the edge of the BGA board is upturned. The smile curve is formed, and the circuit board is too long due to TAL (Time Above Liquidus), and the temperature difference between the upper and lower furnaces of the reflow furnace is too large, and the two-phase interaction forms a circuit board to bend down，Caused the so-called cry curve. If the cry curve, smile curve is severely deformed, short-circuit and air-welding of the BGA will be formed at the same time, which is usually the case when both occur at the same time. The picture shows that the BGA smile curve and the cry curve on the printed circuit board strongly squeeze the BGA solder balls, causing several short circuits. In general, consider reducing the slope of the reflow oven, either by preheating the BGA to eliminate thermal stress, or by requir...

Seamark ZM X ray machine investment improves Your company’s quality inspection capabilities https://www.youtube.com/watch?v=KD7-1rfmoL8

IC semiconductor X-Ray inspection system X7600 X-Ray inspection system is high-precision detection equipment. It inspects and analyzes the inner structure of the object without damage via the penetration power from X-Ray. It has been widely applied to BGA detection , LED, SMT, semiconductor, battery, automotive electronics, ceramic products, casting, plastic, connectors, 2.5D image analysis, pharmaceutical products and other industries. –Inspection of internal cracks and Defects analysis of internal conditions (Analysis of internal displacements) SMT/Semicon/Solar/Conn/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 100KV 3um (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digital flat panel detector 6 axis linkage system. 60 degrees observation Platform 360° rotation Color lmage Navigation & Mapping Navigation Mapping Mosaic Function.(optional ) Scalable 3D module(industrial ...