X Ray BGA machine use - detecting bga PCB
X Ray BGA machine use - detecting bga PCB www.seamarkxray.com BGA- B all array package, which is a highly integrated package, uses array solder balls on the bottom of the package substrate to interconnect the I/O terminals of the circuit with the printed circuit board PCB. The quality of the BGA soldering has a large impact on the packaged device. X Ray BGA machine use ： Since the packaged product cannot be visually inspected, X Ray inspection BGA machine, ultrasonic can detect the quality. The most commonly used tool is X-RAY BGA machine, which not only has the function of visual inspection, but also saves the image for analysis ， area measurements can be made on the contours of product defects. BGA solder joint inspection application: IC, PCBA, LED, lithium battery, IGBT, etc. Object detection: For chip size measurement, chip position, cavity, lead frame, wire, open circuit of connection line, short circuit, abnormal connection, ceramic capacitor structure, tr...