Laser tin soldering machine 视觉同轴激光锡丝焊锡机-Seamark zm

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With the improvement of IC chip design level and manufacturing technology, SMT is developing towards high-density and high-reliability miniaturization. Therefore, the traditional welding method is also challenged. The new laser soldering will become a new weapon in the welding field. At present, the pin center distance of QFP has reached 0.3mm, and the number of pins of a single device can reach more than 576. This makes the traditional soldering method extremely prone to "bridge" of adjacent lead solder joints when soldering such fine pitch components.


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